Semiconductor Packaging Market Size Share Trends Demand Growth and Competitive Analysis Insights 2022-2029 | DataM Intelligence


The semiconductor packaging market size is estimated to reach USD Million by 2029, growing at a CAGR of 7.2% during the forecast period (2022-2029).

Market Overview:

Semiconductor manufacturing and design each require packaging. At the macro level, it affects cost, performance, and power, while at the micro level, it impacts the essential functioning of all chips. The housing serves as a housing for the semiconductor chip. Even though foundries are stepping up their packaging efforts, packaging can still be handled through an extraordinary vendor, OSAT.

As soon as the thought appeared, packages appeared as an unimportant secondary element of the configuration of semiconductors. They are important in every degree and as problems and profitability increase, foundries and OSATs compete for a larger share of this market. The package connects the chip to a board or other chips, protects the chip, and can also exhaust heat.

An embedded circuit is created through the semiconductor chip to the semiconductor pC A. Organic substrates, bond wires, lead frames, ceramic programs, chip bonding materials and different substances are used in semiconductor packaging. The growth of the semiconductor market has an immediate impact on the market below, as packaging is a first step in the electronics cost chain. For example, OSATs handle packaging wishes from Qualcomm, an organization that manufactures semiconductors and telecommunications equipment.

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Market dynamics

The electronic acquirer zone in development

The global semiconductor packaging market is expected to grow owing to increasing usage of electronics by customers, growth based on international per capita incomes, and growing accessibility of electronic gadgets owing to improving the standard of living. The expansion of the semiconductor packaging industry is expected to be facilitated by the improvement of digital products for customers, including laptops, pills, health bracelets, smart watches and other devices. digital applications requiring complex semiconductor integration.

The link between the integrated circuit and the printed circuit is provided by means of an electronic unit (PCB). Another reason is to provide the correct mechanical and environmental protection to ensure overall reliability and performance. Additionally, an increase in the use of synthetic intelligence (AI) and the Internet of Things (IoT) in consumer electronics, telecommunications, robotics, automotive, aerospace, and protection and other industries for advanced software compatible hardware is expected to support the semiconductor packaging market length growth in the predicted length.

Market segmentation :

By technology

  • Grid array
  • Small outline packaging
  • Lead Free Flat Package
  • Double-line packaging

By material

Per end user

  • Consumer electronics
  • Automotive
  • Health care
  • IT & Telecommunications

Competitive landscape

There are many packaging solution providers for the semiconductor industry, so the semiconductor packaging market is expected to be moderately fragmented. Players use product innovation, expansions, and alliances to stay ahead of the competition and expand their market reach.

Samsung unveiled its new line of chipsets for its fifth-generation (5G) solutions and products in June 2021. These include Compact Macro, Massive MIMO radios and baseband units, all of which will be released in 2022.

The strategic partnership between ASE Group and Apple Inc. to gradually increase energy efficiency and transition to greener production was finalized in July 2020. This cooperation also helps the supply chain clean energy program and its suppliers. Moreover, it will build a strong brand reputation for that business.

Global leading companies in the semiconductor packaging market include Amkor Technology, Inc., ASE Group, Fujitsu Ltd, Jcet/Stats Chippac Ltd, Siliconware Precision Industries Co. Ltd (Spil), Powertech Technology, Inc., Tianshui Huatian Technology Co. Ltd, Chipmos Technologies, Inc., Chipbond Technology Corporation and Samsung Electronics Co. Ltd.

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